Complementing our semiconductors, e2v also offers assembly, test, and packaging services.

Semiconductor assembly, packaging, and testing

Complementing our range of semiconductor products, e2v also offers assembly, test, and packaging services, specifically:

State-of-the-art manufacturing, qualified to QML Class Q and V in both US and European facilities

  • Wafer-processing capability, hot and cold temperature handling and testing
  • Package redesign and characterization with thermal analysis and qualification
  • Hi-rel screenings, burn-in, life-testing – custom screening options available on request
  • Complete test development, migration, and military temperature qualification
  • Packaging and test capability retained for legacy and EoL products and processes

Legacy equipment maintained and porting to new test equipment as required.


What next?Contact us online if you require more information or you have a pricing enquiry.Contact us

Copyright © Teledyne e2v (UK) Ltd 2017. Web design by Focus, an integrated marketing agency

This website contains various proprietary trademarks of Teledyne e2v (UK) Ltd and Teledyne Technologies, including the registered trademarks Teledyne and e2v.