e2v inc is certified to ISO9001:2008 with AS9100:2009 Rev C.

In addition, the products and services provided from the e2v group through e2v inc are from ISO9001 certified plants:

Quality Overview

e2v inc. has quality systems that are based upon the military performance requirements of MIL-PRF-38535 and MIL-STD-883 Test Method Standard for Microcircuits.

A detailed description of our quality organization and supporting documentation is covered in the Management System Manual.

QML Level V and Q Certification

Transitional Qualified Manufacturers Listing (QML) level Q certification was originally granted by the Defense Logistics Agency (DLA) on July 16, 1998. Full Q level certification was granted on July 17, 2003. Full V level certification for space level manufacturing flows was granted on November 10, 2004.
QML Certification letter 
QML Certification 

The QML certification includes the following technologies, facilities, and approved subcontractors:

Technology types:

Bipolar, Linear, MCO, Digital, FAST, ECL, CMOS, BiCMOS, HCMOS

Product types:

Bipolar Memory, Linear, Microcontroller, SRAM, PROM, EPROM, PLD, and Logic

Assembly operations:

e2v inc. Milpitas, CA
Microchip Technology (Thailand) Co., Ltd., Bangkok, Thailand

Electrical operations:

e2v inc. Milpitas, CA
Microchip Technology (Thailand) Co., Ltd., Bangkok, Thailand

Environmental test operations:

e2v inc. Milpitas, CA
Microchip Technology (Thailand) Co., Ltd., Bangkok, Thailand

Products qualified and listed with DLA

e2v qualifies a larger percentage of its QP Semi product lines in full compliance with MIL-PRF-38535 requirements and submits these qualifications for listing with DLA than any other manufacturer. Current levels of support from all QML manufacturers are analyzed via data provided by DLA and published via this linked page: Number of Qualified Devices Ranked by Vendor. This hyperlink to DLA provides the full list of all devices QML qualified for e2v inc. (QP Semiconductor): Devices Listed with DLA for e2v inc(QP Semiconductor).

DLA-approved test methods

Laboratory Suitability to MIL-STD-883 Test Methods was originally approved by DLA in July 1997, and re-certified on July 17, 2003 and November 10, 2004. Laboratory Suitability Certification letter 
Laboratory Suitability Certification

Product quality and reliability

All new products are designed to meet MIL-PRF-38535 requirements, including metallization, step coverage, and current density.

Scanning electron microscope (SEM) inspections are performed on procured wafers and die to verify the step coverage and current density requirements of MIL-PRF-38535.

All standard products are screened to the requirements of MIL-PRF-38535. This includes MIL-STD-883 Method 5004 screening and MIL-STD-883 method 5005 Qualification and Quality Conformance procedures.

Traceability to the wafer lot is maintained throughout manufacturing. A unique mark lot number is marked on the finished device for this purpose.

Die qualification testing

For die or wafers manufactured by an uncertified source, Qualification testing is performed per e2v inc. procedures. For Qualification of die or wafers from a DLA-certified source, the same testing is performed per e2v inc. procedures with the exception of Subgroups D3 and D4, which are done as part of the periodic Group D QCI testing.

Reference standards

Mil-PRF-38535 can be found at the DLA Website: Current Mil-PRF-38535
Mil-STD-883 can be found at the DLA Website: Current Mil-STD-883
Mil-STD-1835 can be found at the DLA Website: Current Mil-STD-1835

Management System Certifications

e2v inc products are certified to AS9100 Revision C. pdf




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